In the stack up design of an RF card, Rogers RO4003C dielectric material will be used.
In addition, the thickness value of the dielectric to be used is 203.2 um.
There is a Renesas BGA component in the design of the same card, but the pin to pin value has an air gap value of 0.25. At best, even if a 0.127 um thick line is used, insufficient airgap occurs.100x300 vias must be used for these 0.25 mm component pins, otherwise other vias exceed the pin size. However, when 100x300 microvia is used, aspect ratio cannot be provided.Microvia aspect ratio value is 0.75:1, but when 100x300 microvia is used according to 17+25 copper and 203.2 dielectric used for the top, our aspect ratio value is 2.452.I am sending you the footprint and component datasheet in the attachment. If you encounter such a situation, what are the production constraints and what kind of design can you suggest?
F6513AVGI8.pdfF6513AVGI8_Footprint.pdf
Renesas has sold this RF product to Axiro effective April 2, 2025. For support please contact them directly at [email protected]
https://axiro.com/en/products/phased-array-beamformers/106
Best regards, Cindy