Hi, I got a question regarding the thermal resistance(K/W) of the GaN Power Transistor ISL70024SEH. It is stated in the datasheet that the typical thermal resistance from junction to case is 18.7 K/W and it is to my understanding that this value is for the bottom side of the package. Is it possible for you to provide the information regarding the thermal resistance from junction to the top of the case? In other words, what would be the thermal resistance from junction to case top if we use the 2resistor model?
We apologize but we cannot answer questions on a public forum for our space parts unless the information is already posted on our public website. In this case, the information is not publicly released and must be given to approved customers only.
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Best regards, Cindy, Renesas Electronics, Online Applications Support Engineer