Since this BGA is package is very small and fine pitch (0.4mm). The enable pin is 2B or B2 in 3x3 array. that is the middle one where it's really difficult to take out a trace on the layer. Hence, I have to add drill on the pad and connect it to VIN via pull up resistor as shown in the Evaluation board. Apparently this is making it difficult for the manufacturer to fabricate PCB.
So, my question is whether I can connect Enable pin directly to VIN in ISL9120IINZ?
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